Practical Components
dummy components, tools and kits
S-CSP
Stacked Chip Scale Package
Chip Scale
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See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
Amkor’s Stacked CSP packages leverage existing CABGA manufacturing capabilities and proven package infrastructure while adding the enhancement of placing one die on top of another.
Stacked CSP packages combine the use of thin core substrate material, wafer backgrinding know-how (to 7 mils), and conventional BGA surface mount techniques. This technology allows for very efficient use of motherboard real estate, reducing size and weight and supporting the customer's system level cost reduction needs.
| S-CSP Stacked Chip Scale Package | |||||
|---|---|---|---|---|---|
| Part Number | I/O Count | Pitch | Body Size |
Ball Matrix |
Qty Per Tray |
| A-CSP72-.8mm-8x10mm | 72 | .8mm | 8 x 10mm | 8 x 12 | 220 |
| A-CSP72-.8mm-8x11mm | 72 | .8mm | 8 x 11mm | — | |
| A-CSP72-.8mm-8x12mm | 72 | .8mm | 8 x 12mm | — | |
- Low profile package height (1.4mm max.)
- Flash/SRAM combination with up to 72 I/O.
- Established package infrastructure with standard CABGA footprints.
- Consistent product performance and reliability.
- JEDEC MO-219 Standard Outlines.
- Moisture resistance testing JEDEC Level 3 @ 240 °C
