Practical Components
dummy components, tools and kits
CTBGA
ChipArray® Thin Core BGA
Ball Grid Array
- CVBGA Very Thin Chip Array® BGA —Amkor
- CABGA Chip Array® BGA —Amkor
- TapeArray® BGA—Amkor
- CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array Pitch
- SuperBGA®—Amkor
Quick Link to: CTBGA Component Drawings
- * = DC available
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- Daisy-chained connections are connections between I/O (input/output) of the component.
- BT (Bismaleimide-Triazine) substrates.
- JEDEC MS-034 standard outlines.
- Ball diameter varies (see chart).
- BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy, or (SAC305) 96.5% Sn/ 3.0% Ag/ 0.5% Cu alloy, or (SAC105) 98.25% Sn/ 1.2% Ag/ 0.5% Cu/ 0.05% Ni alloy is also available.
