Practical Components
dummy components, tools and kits
PBGA
Plastic Ball Grid Array
Ball Grid Array
Quick Link to: PBGA Component Drawings
Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs are designed for low inductance, improved thermal operation and enhanced SMT-ability.
Quick Link to: PBGA Solder Information
| PBGA Plastic Ball Grid Array (1.5mm / 1.27mm Pitch) | ||||||
|---|---|---|---|---|---|---|
| Part Number | I/O Count |
Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Qty Per Tray |
| A-PBGA119-1.27mm-14x22mm* | 119 | 1.27mm | 14 x 22mm | 7 x 17 | Full Grid | 96 |
| A-PBGA121-1.27mm-15mm | 121 | 1.27mm | 15mm | 11 x 11 | Full Grid | 126 |
| A-PBGA208-1.27mm-23mm* | 208 | 1.27mm | 23mm | 17 x 17 | Perimeter | 60 |
| A-PBGA217-1.27mm-23mm* | 217 | 1.27mm | 23mm | 17 x 17 | Perimeter | 60 |
| A-PBGA225-1.50mm-27mm* | 225 | 1.50mm | 27mm | 15 x 15 | Full Grid | 40 |
| A-PBGA256-1.27mm-27mm* | 256 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| A-PBGA272-1.27mm-27mm* | 272 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| A-PBGA304-1.27mm-31mm* | 304 | 1.27mm | 31mm | 23 x 23 | Perimeter | 40 |
| A-PBGA313-1.27mm-35mm* | 313 | 1.27mm | 35mm | 25 x 25 | Stagger | 24 |
| A-PBGA316-1.27mm-27mm | 316 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| A-PBGA329-1.27mm-31mm | 329 | 1.27mm | 31mm | 23 x 23 | Perimeter | 27 |
| A-PBGA352-1.27mm-35mm* | 352 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| A-PBGA356-1.27mm-27mm* | 356 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| A-PBGA388-1.27mm-35mm* | 388 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| A-PBGA420-1.27mm-35mm | 420 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| A-PBGA456-1.27mm-35mm | 456 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| A-PBGA564-1.27mm-40mm* | 564 | 1.27mm | 40mm | 30 x 30 | Perimeter | 21 |
- Pin counts and body sizes change on an ongoing basis. Please call for updated listing of available packages.
- Body sizes ranging from 2 x 3mm to 12 x 12mm.
- Solder plating is 85/15 Sn/Pb.
- MLF package is a near CSP plastic encapsulated package with a copper leadframe substrate.
- Parts are packaged in tubes.
- Parts are available in trays upon special request.
- Small size (50% space reduction as compared with TSSOP).
- 0.75 ± 0.9mm mounted height.
- All lead frames are silver plated.
- MLFs are available daisy-chained (please call for more details).
- Lead-free parts are available with 100% Sn alloy.
| PBGA Plastic Ball Grid Array (1.0mm Pitch) | ||||||
|---|---|---|---|---|---|---|
| Part Number | I/O Count |
Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Quantity Per Tray |
| A-PBGA144-1.0mm-13mm | 144 | 1.0mm | 13mm | 12 x 12 | Full Grid | 160 |
| A-PBGA156-1.0mm-15mm | 156 | 1.0mm | 15mm | 14 x 14 | Perimeter | 126 |
| A-PBGA160-1.0mm-15mm | 160 | 1.0mm | 15mm | 14 x 14 | Perimeter | 126 |
| A-PBGA196-1.0mm-15mm | 196 | 1.0mm | 15mm | 14 x 14 | Full Grid | 126 |
| A-PBGA208-1.0mm-17mm | 208 | 1.0mm | 17mm | 16 x 16 | Perimeter | 90 |
| A-PBGA256-1.0mm-17mm | 256 | 1.0mm | 17mm | 16 x 16 | Full Grid | 90 |
| A-PBGA288-1.0mm-23mm | 288 | 1.0mm | 23mm | 22 x 22 | Perimeter | 60 |
| A-PBGA289-1.0mm-19mm | 289 | 1.0mm | 19mm | 17 x 17 | Full Array | — |
| A-PBGA324-1.0mm-19mm | 324 | 1.0mm | 19mm | 18 x 18 | Perimeter | 84 |
| A-PBGA324-1.0mm-23mm | 324 | 1.0mm | 23mm | 22 x 22 | Perimeter | 60 |
| A-PBGA456-1.0mm-27mm | 456 | 1.0mm | 27mm | 26 x 26 | Perimeter | 40 |
| A-PBGA484-1.0mm-27mm | 484 | 1.0mm | 27mm | 26 x 26 | Perimeter | 40 |
| A-PBGA516-1.0mm-31mm | 516 | 1.0mm | 31mm | 30 x 30 | Perimeter | 27 |
| A-PBGA580-1.0mm-35mm | 580 | 1.0mm | 35mm | 34 x 34 | Perimeter | 24 |
| A-PBGA676-1.0mm-27mm | 676 | 1.0mm | 27mm | 26 x 26 | Full Grid | 40 |
| A-PBGA680-1.0mm-35mm | 680 | 1.0mm | 35mm | 34 x 34 | Perimeter | 24 |
| A-PBGA1156-1.0mm-35mm | 1156 | 1.0mm | 35mm | 34 x 34 | Full Array | 24 |
- Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- All components are daisy-chained.
- Daisy-chained connections are connections between I/O (input/output) of the component.
- BT (Bismaleimide-Triazine) substrates.
- JEDEC MS-034 standard outlines.
- Ball diameter varies (see chart).
- BGA packages should be baked at 125°C for 24 hours prior to assemblyto prevent delamination during the assembly process.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with 96.5% Sn/ 3.0% Ag/ 5% Cu alloy.
