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Quad Flat Pack

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Quick Link to: TQFP Component Drawings

Thin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are helping to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.

TQFP Die Up (Std)   TQFP Die Down (Inv)

ePad L/TQFP Die Up (Std)
TQFP Thin Quad Flat Pack (1.0mm thick)
Part Number Number
of Pins
Body
Size
Lead
Pitch
Footprint Qty
Per Tray
Tape
Width
Tape
Pitch
Qty
Per Reel
A-TQFP32-5mm-.5mm-2.0* 32 5mm sq .5mm 2.0mm 360 16mm 12mm 1,000
A-TQFP32-7mm-.8mm-2.0* 32 7mm sq .8mm 2.0mm 250 16mm 12mm 1,000
A-TQFP40-5mm-.4mm-2.0* 40 5mm sq .4mm 2.0mm 360 16mm 12mm 1,000
A-TQFP44-10mm-.8mm-2.0* 44 10mm sq .8mm 2.0mm 160 24mm 16mm 1,000
A-TQFP48-7mm-.5mm-2.0 48 7mm sq .5mm 2.0mm 250 16mm 12mm 1,000
A-TQFP52-10mm-.65mm-2.0 52 10mm sq .65mm 2.0mm 160 24mm 16mm 1,000
A-TQFP64-7mm-.4mm-2.0* 64 7mm sq .4mm 2.0mm 250 16mm 12mm 1,000
A-TQFP64-10mm-.5mm-2.0* 64 10mm sq .5mm 2.0mm 160 24mm 16mm 1,000
A-TQFP64-14mm-.8mm-2.0 64 14mm sq .8mm 2.0mm 90 32mm 24mm 750
A-TQFP80-12mm-.5mm-2.0 80 12mm sq .5mm 2.0mm 119 24mm 24mm 1,000
A-TQFP80-14mm-.65mm-2.0* 80 14mm sq .65mm 2.0mm 90 32mm 24mm 750
A-TQFP100-14mm-.5mm-2.0* 100 14mm sq .5mm 2.0mm 90 32mm 24mm 750
A-TQFP120-14mm-.4mm-2.0 120 14mm sq .4mm 2.0mm 90 32mm 24mm 750
A-TQFP128-14mm-.4mm-2.0* 128 14mm sq .4mm 2.0mm 90 32mm 24mm 750
A-TQFP128-20mm-.5mm-2.0 128 20mm sq .5mm 2.0mm 60 44mm 24mm 500
A-TQFP144-20mm-.5mm-2.0 144 20mm sq .5mm 2.0mm 60 44mm 24mm 500
A-TQFP176-20mm-.4mm-2.0 176 20mm sq .4mm 2.0mm 60 44mm 24mm 500
  • * = Available as an Exposed Pad L/TQFP Package by Amkor. The ExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The ePad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. TQFP is available in die up configurations in 1.0mm thickness only.
  • 5 x 5mm to 20 x 20mm body size (JEDEC Standard).
  • 32 to 176 lead counts.
  • Copper leadframes.
  • 1.0mm body thickness for TQFP.
  • Moisture sensitivity is JEDEC level 3.
  • Lead-free parts are available with 98.5% Sn/ 1.5% Cu finish or 100% Sn finish.

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