Practical Components

tsCSP Thin Substrate Chip Scale Package

Ball Grid Array

• CVBGA Very Thin Chip Array® BGA —Amkor
• CABGA Chip Array® BGA —Amkor
• TapeArray® BGA—Amkor
• CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
• PBGA Plastic Ball Grid Array —Amkor
• PBGA Plastic Ball Grid Array Pitch
• SuperBGA®—Amkor

Amkor’s tsCSP is a land grid array multi-row package (up to 3–rows of lands) compatible with established CSP mounting processes. The nearchip- size standard outlines offer a broad selection of land pitch, count, and body sizes. By utilizing a thin substrate, standard package height of 0.4mm to 0.6mm can be achieved. Amkor also offers very thin package thickness less than 0.4mm. The package uses Amkor’s ExposedPad™ technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. These enhancements also enable stable ground by use of down bonds or by electrical connection through a conductive die attach material. Amkor tsCSP packages, regardless of body sizes and thicknesses, utilize streamlined, flexible manufacturing process which assures economical packaging solutions. Amkor’s tsCSP is an excellent solution for devices requiring high performance and ultra-thin chip scale applications.

For recommended kits see PCB007
For more information see Amkor Technology
Amkor Data Sheet