Practical Components
dummy components, tools and kits
Flip Chip Test Die Kits
PC Boards and Kits
- PC009-40 Aegis Traceability & Control Validation Kit
- Kit Identifier (component part/kit numbers)
- AIM Print Test Board and Kit
- Pb-Free HASL PCB Finish
- Custom PC Practice Boards and Kits
- CircuitCAM Software—Aegis
- Single Pack Hand Solder Kits
- PC000 Zero-Ohm SMD Resistor PCB/ Kit
- PC003 Solder Practice PCB/Kit
- PC005 BGA Variable Pitch and Array PCB/Kit
- PC007 MLF® Test PCB/Kit
- PC008 Solder Practice PCB/Kit
- PC009 Mixed Technology PCB/Kit
- PC011 BGA Fine Pitch PCB/Kit
- SMTA Saber Evaluation PCB/Kit
- PC012 BGA Global Daisy-Chain Test Kit
- PC013 Though-Hole Solder Training Kit
- PC014 IPC 9850 Attribute Defect Rate Kit
- PC015 Rework Kits
- PC016 IPC Compliant Hand Soldering Kit
- PC020 Practical SMT Kit
- PCB 049- Indium MT/PTH Mixed Technology Board and Kit
- PC200 PoP 14mm Board & Kit—Amkor
- PC200 PoP 12mm Board & Kit—Amkor
- SIR Test board and Kit
- WTK-1 Terminal and Wire Kit
- PC031 Lead-Free Process Capability Validation Kit—Cookson
- Flip Chip Test Die Kits—FlipChip Int'l
- µBGAPC Boards and Kits—Tessera
- Omni Training Kits
- Laser Cut Metal Mask Stencils
FREE CATALOG
See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
CircuitCam™ & Digitized Gerber Files
With an increasing number of I/O’s on Integrated Circuits and accompanying requirements for high performance, flip chip type components become a compelling technology for potential users. Flip Chip Technology test die are combined with factory designed test boards to provide customers with the ability to test a variety of die specs, bump pitches and bump counts. Both components and test boards are daisy-chained for continuity.
Quick Link to: Flip Chip Components
PB18-25x250 Laminate Board
Laminate board is double-sided board. One side has 10 pads for the PB18-250x250, the other side has 10 pads for the PB18-500x500.
Substrate Information
- Board Type—High Temp FR4 (Tg = 176°C)
- Board Thickness—0.031" or 0.062"
- Layers—4 (top, bottom, ground, power) inner layers nonfunctional
- Copper Conductor—1 oz. Cu
- Solder Mask—Taiyo PSR-4000
- Test Site Die—10 (250 x 250 mil2) sites on one side of the board
- Pitch—18 mil
- Minimum Line—6 mil
- Maximum Space—12 mil
- Test Site Die—10 (500 x 500 mil2) sites on one side of the board
- Pitch—18 mil
- Minimum Line—6 mil
- Maximum Space—12 mil
Order Number (board only): PB18-250/500 Laminate
- Kit quantities are subject to change.
- Mix and match components and quantities to create a custom kit. Please contact your sales representative for details.
- PC Board is double-sided (top side for 1.0mm pitch packages / bottom side for 1.27mm pitch package).
- Gerber and X, Y Theta data included at no charge.
- Digitized files provided by Aegis Software included at no charge.
| PB18-250x250 Kits | |||||
|---|---|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
Qty Per 15 Kits |
Qty Per 20 Kits |
| PB18-250-DC | 10 | 50 | 100 | 150 | 200 |
| PB18-250/500 Laminate | 1 | 5 | 10 | 15 | 20 |
| Kit Order Number: | PB18-250-001 | PB18-250-005 | PB18-250-010 | PB18-250-015 | PB18-250-020 |
| PB18-500x500 Kits | ||||
|---|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
Qty Per 15 Kits |
| PB18-500-DC | 10 | 50 | 100 | 150 |
| PB18-250/500 Laminate | 1 | 5 | 10 | 15 |
| Kit Order Number: | PB18-500-001 | PB18-500-005 | PB18-500-010 | PB18-500-015 |
- Lead-free parts are available.
- Digitized files provided by Aegis Software included at no charge.
PB08-2x2 Laminate Board
Laminate board is double sided. One side has 10 pads for the PB8-2x2 (back side is no longer available for the PB8-4x6, this part has been discontinued).
Substrate Information
- Board Type—High Temp FR4
- Board Thickness—0.062"
- Layers—4 (top, bottom, ground, power) inner layers nonfunctional
- Copper Conductor—1/4 oz. or 1/2oz. Cu
- Solder Mask—Taiyo PSR-4000
- Test Site Die—10 (200 x 200 mil2) sites on one side of the board
- Pitch—8 mil
- Minimum Line—4mil
- Minimum Space—4 mil
- Wettable Cu Pad—4 x 8 mil2 (defined using a solder mask)
- Purpose—Flip Chip on FR-4 board with daisy-chain structure
Board Size: 3.5" x 5.5"
Order Number: PB08-2x2-Laminate PCB
| PB08-200x200 Kits | |||||
|---|---|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
Qty Per 15 Kits |
Qty Per 20 Kits |
| PB08-200x200-DC | 10 | 50 |
100 | 150 | 200 |
| PB08 Laminate Board | 1 | 5 | 10 | 15 | 20 |
| Kit Order Number: | PB8-2x2-001 | PB8-2x2-005 | PB8-2x2-010 | PB8-2x2-015 | PB8-2x2-020 |
- Digitized files provided by Aegis Software included at no charge.
FA10-2x2 Laminate Board
Laminate is only available for FA10-2x2. Single-sided pattern.
Substrate Information
- Board Type—High Temp FR4
- Board Thickness—0.031"
- Layers—4 (top, bottom, ground, power) inner layers nonfunctional
- Copper Conductor—1/4 oz. or 1/2oz. Cu
- Solder Mask—Taiyo PSR-4000
- Test Site Die—10 (200 x 200 mil2) sites on one side of the board
- Pitch—10 mil array
- Minimum Line—4 mil
- Minimum Space—4 mil
- Wettable Cu Pad—5 mil diameter, round
- Through-Hole Via—8 mil drill, 10 mil; capture pad
Board Size: 3.5" x 5.5"
Order Number (board only): FA10-2x2-PCB
| FA10-200x200 Kits | |||
|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
| FA10-200x200-DC | 10 | 50 | 100 |
| FA10 Laminate | 1 | 5 | 10 |
| Kit Order Number: | FA10-2x2-001 | FA10-2x2-005 | FA10-2x2-010 |
- Digitized files provided by Aegis Software included at no charge.
