Practical Components

PCB007 / PC007

MicroLeadFrame® (MLF®) Test PC Board and Kits

PC Boards and Kits

• PC009-40 Aegis Traceability & Control Validation Kit
• Kit Identifier (component part/kit numbers)
• AIM Print Test Board and Kit
• Pb-Free HASL PCB Finish
• Custom PC Practice Boards and Kits
• CircuitCAM Software—Aegis
• Single Pack Hand Solder Kits
• PC000 Zero-Ohm SMD Resistor PCB/ Kit
• PC003 Solder Practice PCB/Kit
• PC005 BGA Variable Pitch and Array PCB/Kit
• PC007 MLF® Test PCB/Kit
• PC008 Solder Practice PCB/Kit
• PC009 Mixed Technology PCB/Kit
• PC011 BGA Fine Pitch PCB/Kit
• SMTA Saber Evaluation PCB/Kit
• PC012 BGA Global Daisy-Chain Test Kit
• PC013 Though-Hole Solder Training Kit
• PC014 IPC 9850 Attribute Defect Rate Kit
• PC015 Rework Kits
• PC016 IPC Compliant Hand Soldering Kit
• PC020 Practical SMT Kit
• PCB 049- Indium MT/PTH Mixed Technology Board and Kit
• PC200 PoP 14mm Board & Kit—Amkor
• PC200 PoP 12mm Board & Kit—Amkor
• SIR Test board and Kit
• WTK-1 Terminal and Wire Kit
• PC031 Lead-Free Process Capability Validation Kit—Cookson
• Flip Chip Test Die Kits—FlipChip Int'l
• µBGAPC Boards and Kits—Tessera
• Omni Training Kits
• Laser Cut Metal Mask Stencils

Nearly all package types are now available in lead-free formulations and dummy packages are available as small as 0402 metric.

FREE CATALOG

See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.

CircuitCam™ & Digitized Gerber Files

This new PCB007 MicroLeadFrame® (MLF®) Test PC Board is two test boards in one. The front side of the board consists of daisy-chained MLF® pads. Amkor’s new MLF® packages are a near CSP plastic encapsulated package with a copper leadframe substrate. MLF® packages have perimeter pads on the bottom of the package. Thermal enhancement is provided by Amkor’s ExposedPad™(ePad™) technology.

This test board has land patterns for MLF® package sizes of 2x3mm to 10x10mm in varying I/O counts. Lead pitches of these include 0.5mm, 0.65mm and 0.8mm. Pitch sizes between the pads on the board are 0.65mm and 0.5mm. The MLF® side of the PCB007 Board is designed to help customers become more familiar with the placement and process characteristics of MLF packages. The wide assortment of pad sizes and pitches provide a comprehensive overview of MLF® packages. Daisy-chain patterns on the PCB007 board complement the patterns on the components, allowing continuity to be tested.

The bottom side of the PCB007 test board provides a variety of SMD component types. The bottom of the board has LQFP components with 0.4mm pitch and 0.3mm pitch, pads for the PBGA256 component with a 1.00mm pitch and two TSOP Type II components, the TSOP54 with a 0.8mm pitch and the TSOP86 with a 0.5mm pitch. Standard board finish for the PCB007 is Alpha Level Silver Flash. Other finishes are available upon request. Standard thickness is 0.062".

Customers always have the option of mixing and matching components to suit their requirements.
  Board Size: 8" x 5.5"

Order Number: PCB007 (PC Board Only)

Quick Link to: Amkor MLF MicroLeadFrame® Dummy Components