Practical Components
dummy components, tools and kits
BQFP
Bumpered Quad Flat Pack
Ball Grid Array
- CVBGA Very Thin Chip Array® BGA —Amkor
- CABGA Chip Array® BGA —Amkor
- TapeArray® BGA—Amkor
- CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array Pitch
- SuperBGA®—Amkor
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BQFP packages have a bumper extruding from each of the four corners of the package. BQFP packages are a JEDEC compliant package. The lead pitch is a true 25 mil (.636mm). This package is declining in popularity.
| BQFP Bumpered Quad Flat Pack | ||||
|---|---|---|---|---|
| Drawing | Part Number | Number of Pins |
Body Size |
Lead Pitch |
| Drawing | BQFP100-22.6mm-.636mm | 100 | 22.6mm | .636mm |
| BQFP132-27.7mm-.636mm | 132 | 27.7mm | .636mm | |
- BQFPs are packaged in trays.
- Call for tape and reel quantity and availability.
