Practical Components
dummy components, tools and kits
HSOP
Heat Slug Automotive Power Packages
Small Outline
- SOIC/SOJ Small Outline Integrated Circuit
- HSOP Heat Slug Automotive Power Pkg
- TSSOP Thin Shrink Small Outline Pkg—Amkor
- SSOP Small Shrink Outline Pkg—Amkor
- TSSOP Thin Shrink Small Outline Pkg
- PLCC Plastic Leaded Chip Carrier
Heat Slug Automotive Power Packages (HSOP) are normally used in automotive applications. The HSOP package has an exposed heat slug. The heat slug is in a “down” version to better dissipate heat. Parts are available in tubes and on tape and reel. This is a new style of package for Practical Components. Please call regarding availability for new pin counts and lead-free.
Quick Link to: HSOP Drawing
| HSOP Heat Slug Automotive Power Packages | |||||||
|---|---|---|---|---|---|---|---|
| Part Number | Number of Pins |
Pitch | Body Size |
Qty Per Tube |
Tape Width |
Tape Pitch |
Qty 13" Reel |
| HSOP20-1.27mm-11.10mm | 20 | 1.27mm | 11 x 16mm | 30 | 24mm | 20mm | 750 |
| HSOP30-.8mm-11.10mm | 30 | .8mm | 11 x 16mm | 30 | 24mm | 20mm | 750 |
- Pre-plated leadframe (Ni/Pd).
- Gold wire ball bond up to 3mil.
- Copper wire bonding capable.
- Auto mold.
- Moisture Level 1 capable.
- Parts are packaged in tubes.
- Parts available on tape and reel.
