Practical Components
dummy components, tools and kits
PBGA
Plastic Ball Grid Array
Ball Grid Array
- CVBGA Very Thin Chip Array® BGA —Amkor
- CABGA Chip Array® BGA —Amkor
- TapeArray® BGA—Amkor
- CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array Pitch
- SuperBGA®—Amkor
Plastic Ball Grid Array (PBGA) packages are designed for low inductive, improved thermal operation and enhanced SMT ability. PBGA packages are ideal for microprocessors/controllers, ASICs, gate arrays, memory, DSPs and PC chip set applications. PBGA packages consist of a BT (Bismaleimide-Triazine) substrates with eutectic (63/37) solder balls attached. Solder ball pitches are 1.0mm, 1.27mm and 1.5mm. Solder Ball patterns can come perimeter, staggered or full ball array. Body sizes can range from 13mm to 45mm. PBGAs are JEDEC standard outlines.
| PBGA Plastic Ball Grid Array (1.5mm / 1.27mm Pitch) | |||||||
|---|---|---|---|---|---|---|---|
| Drawing | Part Number | I/O Count |
Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Quantity Per Tray |
| Drawing | PBGA169-1.5mm-23mm* | 169 | 1.5mm | 23mm | 13 x 13 | Full Grid | 60 |
| Drawing | PBGA225-1.5mm-27mm* | 225 | 1.5mm | 27mm | 15 x 15 | Full Grid | 40 |
| Drawing | PBGA256-1.27mm-27mm* | 256 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| Drawing | PBGA272-1.27mm-27mm* | 272 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| Drawing | PBGA292-1.27mm-27mm* | 292 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| Drawing | PBGA313-1.27mm-35mm* | 313 | 1.27mm | 35mm | 25 x 25 | Stagger | 24 |
| Drawing | PBGA352-1.27mm-35mm* | 352 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| Drawing | PBGA388-1.27mm-35mm | 388 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| Drawing | PBGA480-1.27mm-35mm | 480 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| PBGA676-1.27mm-35mm | 676 | 1.27mm | 35mm | 26 x 26 | Full Grid | 24 | |
| PBGA Ball Grid Array (1.0mm Pitch) | ||||||
|---|---|---|---|---|---|---|
| Part Number | I/O Count |
Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Quantity Per Tray |
| PBGA144-1.0mm-13mm* | 144 | 1.0mm | 13mm | 12 x 12 | Full Grid | 160 |
| PBGA156-1.0mm-15mm* | 156 | 1.0mm | 15mm | 14 x 14 | Perimeter | 126 |
| PBGA160-1.0mm-15mm* | 160 | 1.0mm | 15mm | 14 x 14 | Perimeter | 126 |
| PBGA196-1.0mm-15mm* | 196 | 1.0mm | 15mm | 14 x 14 | Full Grid | 126 |
| PBGA208-1.0mm-17mm | 208 | 1.0mm | 17mm | 16 x 16 | Perimeter | 90 |
| PBGA256-1.0mm-17mm | 256 | 1.0mm | 17mm | 16 x 16 | Full Grid | 90 |
| PBGA288-1.0mm-23mm* | 288 | 1.0mm | 23mm | 22 x 22 | Perimeter | 60 |
| PBGA324-1.0mm-23mm* | 324 | 1.0mm | 23mm | 22 x 22 | Perimeter | 60 |
- * = DC available.
- Overall thickness of 1.0mm pitch PBGA packages will vary in size (please call for more details).
- Parts are packaged in JEDEC-trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- Daisy-chain connections are connections between I/O (input/output) of the component.
- BGA packages should be baked at 125°C for 48 hours prior to assembly to prevent delamination during the assembly process.
- Daisy-chain connections are used, paired with a PC board that has complimentary connections between pads in order to test for continuity.
- Parts can be baked and dry-packed.
- Most PBGA packages are assembled with “dummy” die to simulate the CTE of live parts.
- Some components are daisy-chained. Call for more details.
- Moisture sensitivity is JEDEC level 3.
- Other I/O ball counts may become available. Please call for availability.
